硬件在环（Hardware-in-the-Loop, HIL）仿真技术凭借安全性高、工况复现性强、测试效率高的优势，成为电驱系统研发过程中的核心验证手段。针对传统台架测试成本高、极端工况难以模拟的情况，本文构建了一套电驱系统 HIL 测试系统，实现 MCU、TCU 的单独 HIL 测试及二者联合的 HIL 测试。通过典型工况、瞬态动态响应和极限故障注入测试，验证了该 HIL 测试系统的实时性、可靠性与稳定性。

Hardware-in-the-Loop simulation technology, with its advantages of high safety, strong condition reproduction capability, and high testing efficiency, has become an indispensable core verification method in the development process of electric drive systems. In response to the high cost of traditional test benches and the difficulty in simulating extreme conditions, this paper has constructed an HIL test system for electric drive systems, enabling separate HIL testing of MCUs and TCUs, as well as combined HIL testing. Through typical conditions, transient dynamic responses, and extreme fault injection tests, the real-time performance, reliability, and stability of this HIL test system have been verified.