汽车电子集成化对车载智能连接器的微型化、高密度及极端工况可靠性提出极致要求。聚对苯二甲酸丁二醇酯材料凭借优异的电绝缘性、耐热性及尺寸稳定性成为核心壳体材料,但其注塑过程中熔体流动、热传导、压力传递与结晶收缩的多场耦合作用,易诱发非均匀结晶取向与残余应力集中。尤其在微结构连接器制造中,上述耦合效应显著加剧,导致针座翘曲、端子共面度失准等缺陷,直接威胁车载电子系统可靠性。现有工艺优化缺乏系统耦合机制认知,因此,本研究聚焦PBT基连接器注塑过程的多场动态耦合机制,深入探析温度-流场-应力交互规律,以期为高精度、高可靠车载电子器件的制造提供理论基石。

The integration of automotive electronics puts extreme demands on the miniaturization, high-density and extreme working condition reliability of automotive smart connectors. Polybutylene terephthalate has become the core shell material by virtue of its excellent electrical insulation, heat resistance and dimensional stability, but the multi-field coupling of melt flow, heat conduction, pressure transfer and crystallization shrinkage in the injection molding process is prone to inducing non-uniform crystalline orientation and residual stress concentration. Especially in the manufacture of microstructured connectors, the above coupling effect is significantly exacerbated, resulting in defects such as header warpage, terminal coplanarity misalignment, and other defects, which directly threaten the reliability of the on-board electronic system. The existing process optimization lacks the knowledge of systematic coupling mechanism, therefore, this study focuses on the multi-field dynamic coupling mechanism of the injection molding process of PBT-based connectors, and explores the temperature-flow-stress interaction law in depth, with a view to providing a theoretical cornerstone for the manufacturing of high-precision and high-reliability in-vehicle electronic devices.